PNP 6600EVO Multifunctional High-precision Die Bonding
Flip Chip, Eutectic Bonding, Front-Side Mounting, Pre-sintering
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Packaging AOI Series
Gold Wire Bonding (2D + 3D) Single/Double-sided Appearance Inspection, Green Tape Appearance Inspection
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Testing and Sorting Series
KGD Testing and Sorting for Chips below 1mm, Testing and Sorting for Active and Passive Components, Testing and Sorting for Components under Special Testing Conditions
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EC300Plus Wire Bonding & Chip Appearance Inspection Machine
Gold Wire Bonding (2D + 3D), the highest visual accuracy is 1um, ultra-depth-of-field fusion technology
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High-speed Three-in-one Testing Equipment
Appearance Defect Detection, Electrical Performance Testing, Finished Product Packaging
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ACP - 3T Online Automatic Pressing Machine
Z-axis Floating Pressing Head, Intelligent Automatic Width-adjustable Track, Multi-slot Connector Pressing Die Storage Rack
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SCP - 5T Fully Automatic Servo Pressing Machine
High-precision Loading Platform, Automatic Die Switching, Automatic Pressing
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MCP - 10T High - Precision Pressing Machine
Welding-free, Stroke Precision can Reach the μ Level, Two-stage Electronic Force
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Solutions and cases
Deep cultivation in the field of semiconductor intelligent manufacturing, and constantly create benchmarking scenario-based application solutions
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Nuoding Intelligence
Focus on semiconductor advanced packaging and testing overall solutions
The product line covers chip, discrete device, optical communication, new energy, radio frequency and storage and other fields, and provides one-stop packaging and testing services for the whole industrial chain.
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