PNP 6600 EVOaEutectic welding solidification machine_Die Bonding Series_Product center_Guangzhou Top-leading Intelligent Technology Co.,Ltd

PNP 6600 EVO^aEutectic welding solidification machine

The PNP6600 multifunctional high-precision die bonding machine is mainly used in the semiconductor packaging industry and can be used for various types of integrated packaging.

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multi-chip
Automatically switch between 7 suction nozzles for simultaneous fitting

Large scale bonding platform (300 * 200mm) heating
Thermal uniformity can achieve ± 5 ℃; Suction nozzle heating, thermal uniformity can reach ± 2 ℃

Non contact height measurement,
Accuracy ± 5 μ m, can measure one stick one

Automatic compensation system: It can automatically compensate according to the actual production and installation situation, ensuring the installation accuracy of the equipment during the production process

Self checking device function module: can start basic performance testing of the device with one click, reduce the threshold for use, and ensure device accuracy

Automatic calibration after installation:
Automatically calibrate according to set conditions

PROCESSTechnological process

Specifications

Accuracy

X/Y mounting accuracy (calibration sheet)

±7um@3σ
θ placement accuracy (calibration piece)

±0.1@3σ
Power control range

10g-1kg(Optional50g-5kg)
Power control accuracy

10-200g±5g
>200g-1kg±10g
>1kg±5%

CPH

reflectance standards
CPH2500（±10um@3σ）/CPH2000（±7um@3σ）CPH2500（±10um@3σ）/CPH2000（±7um@3σ）/CPH1500（±5um@3σ）
Eutectic welding process

CPH1200（±15um@3σ）/CPH900（±10um@3σ）/CPH700（±7um@3σ）
(Process time 50ms), actual efficiency is affected by customer process time

Bond Heads

standard

Solder pad mounting head+chip mounting head
rotate

0°- 360°
heating

MAX450°C（Optional non heating bonding head）

Machine size

Length * Width * Height

1650mm x 1600mm x 1800mm

Wafer

Chip Size

0.17-50mm
chip thickness

>50μm
Wafer size

4-12 inches (compatible with 3 * 6 inch mother and child rings)
frame size
FF070,FF105,FF108,FF123;可更改

Tray

Waffle pack/Gel-Pak

5 pieces of 2 * 2 inches (optional 14/35 pieces), 4 pieces of 4 * 4 inches (4 pieces)
Other requirements

Jedec trays, etc

Substrate and carrier

type

FR4,ceramic,BGA, flex,boat,lead frame,waffle pack
Gel-Pak®,JEDEC tray, odd-shape substrates
Platform heating

MAX350°CProtected by an inert gas atmosphere
Scope of substrate work

300mm x 200mm

statistics

uptime

>98%
Yield

>99.95%

optional

hardware

Open platform architecture for complete customization
software

Single component tracking, CAD download, wafer mapping, substrate mapping, barcode scanner, data matrix recognition, etc

PNP 6600 EVOaEutectic welding solidification machine

multi-chip Automatically switch between 7 suction nozzles for simultaneous fitting

Large scale bonding platform (300 * 200mm) heating Thermal uniformity can achieve ± 5 ℃; Suction nozzle heating, thermal uniformity can reach ± 2 ℃

Non contact height measurement, Accuracy ± 5 μ m, can measure one stick one

Automatic compensation system: It can automatically compensate according to the actual production and installation situation, ensuring the installation accuracy of the equipment during the production process

Self checking device function module: can start basic performance testing of the device with one click, reduce the threshold for use, and ensure device accuracy

Automatic calibration after installation: Automatically calibrate according to set conditions

X/Y mounting accuracy (calibration sheet)

θ placement accuracy (calibration piece)

Power control range

Power control accuracy

reflectance standards

Eutectic welding process

standard

rotate

heating

Length * Width * Height

Chip Size

chip thickness

Wafer size

frame size

Waffle pack/Gel-Pak

Other requirements

type

Platform heating

Scope of substrate work

uptime

Yield

hardware

software

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PNP 6600 EVO^aEutectic welding solidification machine

multi-chip
Automatically switch between 7 suction nozzles for simultaneous fitting

Large scale bonding platform (300 * 200mm) heating
Thermal uniformity can achieve ± 5 ℃; Suction nozzle heating, thermal uniformity can reach ± 2 ℃

Non contact height measurement,
Accuracy ± 5 μ m, can measure one stick one

Automatic calibration after installation:
Automatically calibrate according to set conditions