EC300Plus Wire&Chip Appearance Inspection Machine

EC300 Wire&Chip Appearance Inspection Machine is suitable for detecting wire and chip appearance defects in semiconductors and consumer electronics
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Pain point breakthrough
Solving the problem of single-layer intersection detection

Advanced visual technology
Far superior to traditional 3D line scanning technology in terms of accuracy and frame rate

Appearance inspection technology
Self developed point cloud algorithm+super depth fusion technology, which can achieve cross line and super depth of field wire and chip appearance detection technology

Independently developed and controllable
Support multi-layer algorithm and line width percentage defect detection

Diversified production modes
Flexible selection of single machine/connected production

portable
Humanized programming interface, capable of implementing guided programming

Testing itemsTesting items
Specifications
Visual Information
  • camera

    6500W

  • pixel accuracy

    3.2μm/6.4μm

  • Pixel accuracy 2D detection accuracy

    ±2um(Depending on the visual configuration required)

  • 3D detection accuracy (optional)

    Repetition accuracy: ± 2 μ m
    Measurement accuracy: ± 10 μ m arc height detection
    (Depending on the specific visual configuration selected according to the needs)


Product size
  • Compatible with vehicle dimensions

    160~300mm(L)
    50~100mm(W)
    0.1mm~5mm(T)

  • Compatible magazine size

    160~310mm(L)
    60~110mm(W)
    110mm~170mm(T)

  • Orbit altitude above ground

    950±20mm

  • Equipment size

    950mm (L) x 1500mm (W) x 1900mm(H)


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(86)020-84657805
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