PNP 6600 EVOc Pre-sintering Die Bonder_Die Bonding Series_Product center_Guangzhou Top-leading Intelligent Technology Co.,Ltd

PNP 6600 EVOc Pre-sintering Die Bonder

The PNP6600 multifunctional high-precision die bonding machine is mainly used in the semiconductor packaging industry and can be used for various types of integrated packaging.

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multi-chip
Automatically switch between 7 suction nozzles for simultaneous fitting

Large scale bonding platform (300 * 200mm) heating
The thermal uniformity of 300mm x 200mm can achieve ± 5 ℃; Suction nozzle heating, thermal uniformity can reach ± 2 ℃

Non-contact height measurement
Accuracy ± 5 μ m, can measure one stick one

Automatic compensation system: It can automatically compensate according to the actual production and installation situation, ensuring the installation accuracy of the equipment during the production process

Self checking device function module: can start basic performance testing of the device with one click, reduce the threshold for use, and ensure device accuracy

Automatic calibration after installation:
Automatically calibrate according to set conditions

PROCESSTechnological process

Specifications

Accuracy

X/Y mounting accuracy (calibration sheet)

±7um@3σ
θ placement accuracy (calibration piece)

±0.1@3σ
Power control range

200g-50kg
Power control accuracy

>1kg±5%

CPH

reflectance standards
CPH2500（±10um@3σ）/CPH2000（±7um@3σ）
Pre sintering process

CPH1000 (silver film transfer printing and bonding time are both 0.5s), actual efficiency is affected by customer process time

Bond Heads

standard

Single mount head
rotate

0°- 360°rotate
heating

MAX450 ° C with inert gas atmosphere protection

Machine size

Length * Width * Height

1650mm x 1600mm x 1800mm

Wafer

Chip Size

0.17-50mm
chip thickness

>50μm
Wafer size

4-12英寸（可兼容3*6英寸子(zǐ)母環）
Frame size
FF070,FF105,FF108,FF123;可更改

Tray

Waffle pack/Gel-Pak

5 pieces of 2 * 2 inches (optional 14/35 pieces), 4 pieces of 4 * 4 inches (4 pieces)
Other requirements

Jedec trays, etc

Substrate and carrier

type

FR4,ceramic,BGA, flex,boat,lead frame,waffle pack
Gel-Pak®,JEDEC tray, odd-shape substrates
Platform heating

MAX350°C Protected by an inert gas atmosphere
Scope of substrate work

300mm x 200mm

Silver film transfer printing

range

100*100mm(customizable）
Loading method

Automatic&Manual

統計學

正常運行時(shí)間

>98%
良率

>99.95%

可選項

硬件

用于(yú)完全定制的(de)開放式平台架構
軟件

單組分跟蹤、CAD下載、晶圓映射、基闆映射、條形碼掃描儀、數據矩陣識别等

PNP 6600 EVOc Pre-sintering Die Bonder

multi-chip Automatically switch between 7 suction nozzles for simultaneous fitting

Large scale bonding platform (300 * 200mm) heating The thermal uniformity of 300mm x 200mm can achieve ± 5 ℃; Suction nozzle heating, thermal uniformity can reach ± 2 ℃

Non-contact height measurement Accuracy ± 5 μ m, can measure one stick one

Automatic compensation system: It can automatically compensate according to the actual production and installation situation, ensuring the installation accuracy of the equipment during the production process

Self checking device function module: can start basic performance testing of the device with one click, reduce the threshold for use, and ensure device accuracy

Automatic calibration after installation: Automatically calibrate according to set conditions

X/Y mounting accuracy (calibration sheet)

θ placement accuracy (calibration piece)

Power control range

Power control accuracy

reflectance standards

Pre sintering process

standard

rotate

heating

Length * Width * Height

Chip Size

chip thickness

Wafer size

Frame size

Waffle pack/Gel-Pak

Other requirements

type

Platform heating

Scope of substrate work

range

Loading method

正常運行時(shí)間

良率

硬件

軟件

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multi-chip
Automatically switch between 7 suction nozzles for simultaneous fitting

Large scale bonding platform (300 * 200mm) heating
The thermal uniformity of 300mm x 200mm can achieve ± 5 ℃; Suction nozzle heating, thermal uniformity can reach ± 2 ℃

Non-contact height measurement
Accuracy ± 5 μ m, can measure one stick one

Automatic calibration after installation:
Automatically calibrate according to set conditions