PNP6600EVO Honor Edition

±10um@3σ

PNP6600EVO Flagship Edition

±7um@3σ

PNP6600EVO Extraordinary Edition

±5um@3σ

PNP6600EVO Ultimate Edition

θ placement accuracy (calibration piece)

±0.1@3σ

Power control range

50g-5kg（可選配10g-1kg)

Power control accuracy

10-200g±5g >200g-1kg±10g >1kg±5%

PNP6600EVO Honor Edition

CPH2500

PNP6600EVO Flagship Edition

CPH2500

PNP6600EVO Extraordinary Edition

CPH1000

PNP6600EVO Ultimate Edition

Front facing sticker process

When the process time is 50ms, it is the same as the standard CPH, but the actual efficiency is affected by the customer's process time
The transfer platform method is subject to the impact of the process on actual efficiency

Standard

Single mount head

Rotate

0°- 360°rotate

Length * Width * Height

1650mm x 1600mm x 1800mm

Chip Size

0.17-50mm

chip thickness

>50μm

Wafer size

4-12 inches (compatible with 3 * 6 inch mother and child rings)

frame size

Waffle pack/Gel-Pak

5 pieces of 2 * 2 inches (optional 14/35 pieces), 4 pieces of 4 * 4 inches (4 pieces)

Other requirements

Jedec trays, etc

type

FR4,ceramic,BGA, flex,boat,lead frame,waffle pack
Gel-Pak®,JEDEC tray, odd-shape substrates

Platform heating

MAX350 ° C with inert gas atmosphere protection

Scope of substrate work

300mm x 200mm

uptime

>98%

Yield

>99.95%

hardware

Open platform architecture for complete customization

software

Single component tracking, CAD download, wafer mapping, substrate mapping, barcode scanner, data matrix recognition, etc