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Press Fit 伺服壓接

滿足市面上(shàng)90%以(yǐ)上(shàng)固晶工藝要(yào / yāo)求，多芯片正面貼裝、倒裝芯片貼裝、共晶焊、預燒結，工藝匹配率100%，國(guó)内首家關鍵技術突破已獲得國(guó)家多項發明專利的(de)多功能高精度固晶機。

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Electronics

Press Fit 伺服壓接2

滿足市面上(shàng)90%以(yǐ)上(shàng)固晶工藝要(yào / yāo)求，多芯片正面貼裝、倒裝芯片貼裝、共晶焊、預燒結，工藝匹配率100%，國(guó)内首家關鍵技術突破已獲得國(guó)家多項發明專利的(de)多功能高精度固晶機。

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Electronics

Press Fit 伺服壓接3

滿足市面上(shàng)90%以(yǐ)上(shàng)固晶工藝要(yào / yāo)求，多芯片正面貼裝、倒裝芯片貼裝、共晶焊、預燒結，工藝匹配率100%，國(guó)内首家關鍵技術突破已獲得國(guó)家多項發明專利的(de)多功能高精度固晶機。

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Electronics

Press Fit 伺服壓接4

滿足市面上(shàng)90%以(yǐ)上(shàng)固晶工藝要(yào / yāo)求，多芯片正面貼裝、倒裝芯片貼裝、共晶焊、預燒結，工藝匹配率100%，國(guó)内首家關鍵技術突破已獲得國(guó)家多項發明專利的(de)多功能高精度固晶機。

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