PNP 6600 EVOf Flip Chip Die Bonder_Die Bonding Series_Product center_Guangzhou Top-leading Intelligent Technology Co.,Ltd

PNP 6600 EVOf Flip Chip Die Bonder

The PNP6600 multifunctional high-precision die bonding machine is mainly used in the semiconductor packaging industry and can be used for various types of integrated packaging.

Product
Center

Home / Product center / PNP 6600 EVOf Flip Chip Die Bonder

flip chip
Automatic 180 ° Flip

Ultrasonic bonding system
Alignment accuracy 0.1 μ m

Non contact height measurement,
Accuracy ± 5 μ m, can measure one stick one

Automatic compensation system
It can automatically compensate according to the actual production and installation situation, ensuring the installation accuracy of the equipment during the production process

Self checking device function module
One click start of device basic performance testing, reducing the threshold for use and ensuring device accuracy

Automatic calibration after installation:
Automatically calibrate according to set conditions

PROCESS

Specifications

Accuracy

X/Y mounting accuracy (calibration sheet)

±5um@3σ
θ placement accuracy (calibration piece)

±0.1@3σ
Power control range

50g-5kg(Optional 10g-1kg)
Power control accuracy

10-200g±5g >200g-1kg±10g >1kg±5%

CPH

reflectance standards
CPH2500（±10um@3s ）/CPH2000（±7um@3s ）/CPH1500（±5um@3s）
Inverted process

When the process time is 50ms, it is the same as the standard CPH, but the actual efficiency is affected by the customer's process time

Bond Heads

standard

Single mount head+inverted head
rotate

0°- 360°rotate

Machine size

Length * Width * Height

1650mm x 1600mm x 1800mm

Wafer

Chip Size

0.5-70mm
chip thickness

>50μm
Wafer size

4-12 inches (compatible with 3 * 6 inch mother and child rings)
frame size
FF070,FF105,FF108,FF123;modifiable

Tray Disk

Waffle pack/Gel-Pak

2*2英寸5個(gè)（可選14/35個(gè)），4*4英寸（4個(gè)）
Other requirements

Jedec trays, etc

Substrate and carrier

type

FR4,ceramic,BGA, flex,boat,lead frame,waffle pack
Gel-Pak®,JEDEC tray, odd-shape substrates
Platform heating

MAX350 ° C with inert gas atmosphere protection
Scope of substrate work

300mm x 200mm

statistics

uptime

>98%
Yield

>99.95%

optional

hardware

Open platform architecture for complete customization
software

Single component tracking, CAD download, wafer mapping, substrate mapping, barcode scanner, data matrix recognition, etc

PNP 6600 EVOf Flip Chip Die Bonder

flip chip Automatic 180 ° Flip

Ultrasonic bonding system Alignment accuracy 0.1 μ m

Non contact height measurement, Accuracy ± 5 μ m, can measure one stick one

Automatic compensation system It can automatically compensate according to the actual production and installation situation, ensuring the installation accuracy of the equipment during the production process

Self checking device function module One click start of device basic performance testing, reducing the threshold for use and ensuring device accuracy

Automatic calibration after installation: Automatically calibrate according to set conditions

X/Y mounting accuracy (calibration sheet)

θ placement accuracy (calibration piece)

Power control range

Power control accuracy

reflectance standards

Inverted process

standard

rotate

Length * Width * Height

Chip Size

chip thickness

Wafer size

frame size

Waffle pack/Gel-Pak

Other requirements

type

Platform heating

Scope of substrate work

uptime

Yield

hardware

software